Lenovo Unveils New ThinkEdge Embedded Computer Portfolio For Malaysian Consumers

Lenovo has announced that its entirely new portfolio of embedded computers for the edge is now available to Malaysian customers enabling digital transformation at the edge for healthcare, retail, manufacturing, and all data-dependent industries.

Building on Lenovo’s existing edge portfolio, the new ThinkEdge SE30 and SE50 devices are tiny, durable, and powerful enough to handle the demanding needs of enterprise data processing, security, and scalability at the edge.

Globally, the use of edge computing applications is steadily increasing. By 2025, it is expected that 75 percent of enterprise-generated data would be processed at the edge.

Lenovo’s December 2020 survey of IT executives and managers found that edge computing solutions are an urgent priority, and their deployment is on a fast-track. Fifty-nine percent of those surveyed stated they are “looking to implement new edge computing solutions within the next 6 months.”

Meanwhile, 82 percent stated that “real time data collection and analysis is where edge solutions are making the most impact on their business.”

Acknowledging this, The new Lenovo ThinkEdge devices which are powered by Intel technology is built for the data needs of tomorrow. The embedded edge computers are for customers who need faster processing power, better security, and scalability. With the right data securely on hand for when it matters, businesses can be more efficient, insightful and competitive.

Jon Pershke, Vice President of Strategy and Emerging Business for Lenovo’s Intelligent Devices Group said, “Edge computing is critical infrastructure for intelligent transformation within the enterprise. The new products in the ThinkEdge portfolio are purpose-built devices designed to be networked on premise or embedded in solutions to give Lenovo’s customers an advantage in performance, security and scalability.”

It is equipped with the most recent 11th Generation Intel® CoreTM i5 vPro® processors for industrial computing. The processor boosts processing capacity, speeds AI workloads, and is designed for the challenges of corporate edge implementations, with extended temperature tolerance ranging from -20 to +60 degrees Celsius, as well as long-life reliability.

The ThinkEdge SE30 will launch with 4G support worldwide, followed by 5G availability with key carrier support in the second part of this year. 5G edge devices increase wireless connection to match the low-latency, high-reliability, and high-capacity capabilities of present wireline solutions, while also improving agility and ROI

Embedded applications for the ThinkEdge SE30 include kiosks and ATMs for smart retail, automated production lines in manufacturing, and medical device monitoring in healthcare, among others.

The new ThinkEdge SE50 is designed for versatile applications that require higher analytics and data processing at the edge. The embedded edge compute device includes an Intel® Core™ i5 or i7 vPro® processor for industrial computing and up to 32GB of memory.

End users can deploy the ThinkEdge SE50 to aggregate and analyze real-time data from distributed IoT devices. This smart edge device can filter and forward IoT data across the WAN to the cloud or data center. Customers have the option to enhance their edge AI strategy with cutting edge silicon and optimized software leveraging the OpenVINO™ toolkit.   

Key Features / Specs:

  • 11th Generation Intel® Core™ i7 or i5 vPro® processors for industrial computing
  • 32GB memory and up to 2TB storage
  • Fan-less, operational temperature range of 0 to 50 degree Celsius, and IP50 rating
  • 2-liter design with full industrial I/O

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