Unisem held a groundbreaking ceremony for the commencement of construction of its new semiconductor production facility on a piece of industrial land measuring approximately 28.5 acres in Gopeng, Perak.
Phase 1 of this new Gopeng Plant with an aggregate built up area of about 57,000 square meters with cleanroom facilities, is expected to be completed in April 2023 at an approximate cost of RM300 million.
Once completed, fully facilitised and equipped with the latest state-of-the-art equipment, the Gopeng Plant will serve the needs of their customers with a broad portfolio of products and services. It will also enable UNISEM to double the production capacity of UNISEM’s existing operations in Ipoh.
“The building of this flagship facility at Gopeng reflects the view of the Board that Malaysia remains an important destination in the global semiconductor supply chain. The Gopeng Plant will further create more high value job opportunities for Malaysians whilst contributing to the country’s exports,” Mr John Chia Sin Tet, Chairman/Group Managing Director of UNISEM said.
The ceremony was attended by the Board of Directors and senior management of UNISEM. The representatives of the General Contractor, Zalam Corporation Sdn Bhd and other nominated sub-contractors were also in attendance.
UNISEM established its first semiconductor production facility in Simpang Pulai, Ipoh and commenced production in 1992. Over the years, UNISEM has fully utilised he 15-acre piece of land with a total built-up area of about 570,000 square feet and has 3,500 employees currently.
