Infineon has committed to building a new state-of-the-art wafer fab module in Kulim, with more than RM8 billion worth of investment allocated for the plant.
The third plant which is expected to be completed in Q3 2024 is to add to its manufacturing capacity in power semiconductors, particularly wide bandgap technology based on silicon carbide and gallium nitride.
Dato’ Seri Haji Muhammad Sanusi Md. Nor, the Chief Minister of Kedah commented on the special occasion “Infineon, who has a long-term presence in Kedah, continues to expand in the Kulim Hi-Tech Park (KHTP). Since KHTP’s establishment in 1996, the number of capital-intensive high-tech manufacturing companies has steadily grown bringing advanced technologies and R&D activities as well as high-tech jobs to Kedah state and creating a vibrant economy for the local community.”
“Malaysia is an important hub for Infineon due to economies of scale already present in our front-end wafer fab manufacturing in Kulim and back-end chip manufacturing in Melaka. When fully equipped, products from the new module will generate an additional EUR2 billion in annual revenue. As decarbonisation efforts gain momentum globally, demand from electric vehicles, charging and storage infrastructures, and renewable energy for wide band gap power semiconductors is growing and we are prepared to support the demand,” said Dr. Rutger Wijburg, Chief Operations Officer, Infineon Technologies AG.
MIDA which facilitates foreign manufacturers in establishing businesses in the country aims to make Malaysia one of the key partners in global semiconductor supply chains. The new module will create 900 high-value job opportunities adding to the existing employees at Infineon Kulim.”
