Key ASIC Secures Two More Chip Design Contracts For RM26 Million

Key ASIC has added two more for its ASIC design business from an undisclosed customer totaling over RM26 million over three a year period. This comes following the win of the three earlier contracts of RM28 million announced in October

  1. The group said each contract consists of 2 parts, the Non-Recurring Engineering (NRE) fee which consists of IP licensing and design engineering fees, and the sales of the chips in mass production. As the projects are in the Research and Development phase, details of the contracts are not privy to be disclosed, however, Key ASIC said one of the projects is the design of advanced SoC using 28nm technology while the other chip is a high-end sensor using MEMS technology.
  2. To date, the Company has shipped over 100 million units of chips that have its IPs in the areas of wireless communication, computing, industrial control, power devices, Internet of Things, Artificial Intelligence, digital TV, consumer electronics, automotive and medical applications. The Company has IPs ranging from ADC/DAC to various high-speed interfaces such as PCIe5 and USB3 in various technologies.

“The investment made over the years has built up a large pool of analog IPs and technology platforms that has enabled the Company to deliver 1st-time silicon success in every ASIC design project that we have engaged,” said Mr. Eg Kah Yee, Chairman, and CEO of Key ASIC. “We are focusing in advance technologies ranging from 28nm to 7nm and eventually 5nm projects and we have a healthy backlog and strong pipeline of projects despite the current slowdown in the semiconductor industry,” he commented.

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