Indium Corporation, a US-based global materials supplier to the electronics assembly and semiconductor packaging industries, announced its investment of RM250 million for its expansion in Malaysia with its new manufacturing facility for its advanced solder paste and engineered solder products set to be constructed in Penang.
The new Penang-based facility, which spans 37,500 square feet will manufacture finished products such as solder pastes, fluxes, and preforms. The facility is anticipated to commence operation in two (2) phases, with solder paste manufacturing by the end of 2022 and engineered materials manufacturing in 2023. The project is also anticipated to create 88 high-value new jobs.
This investment announcement coincides with the Trade and Investment Mission to the USA led by YB. Dato’ Seri Mohamed Azmin Ali, Senior Minister and Minister of International Trade and Industry, which included a meeting with Indium Corporation representatives in Washington DC.
In welcoming Indium Corporation’s announcement, Dato’ Seri Azmin said, “It is exciting that Indium is currently planning to leverage on Malaysia’s capabilities in manufacturing operations and has expressed intentions to establish a R&D innovation lab and training facility, signifying its confidence in the local ecosystem and Malaysia’s high-skilled talent.
Indium Corporation’s President and Chief Operating Officer, Ross Berntson enthused, “Indium Corporation is proud to continue its more than 40-year history of doing business in Malaysia with this new manufacturing facility in Penang. Supported by Malaysia’s established supply chain ecosystem for the electronics industry, this new location will allow Indium Corporation to further improve lead times for deliveries while bringing us closer to our customers in the region. We’d also like to express our thanks to MIDA for their assistance with this project.”
Penang also houses the company’s Malaysia Tech Hub, a regional centre for the development of electronics assembly expertise and customer service, as well as a logistics and manufacturing support centre.
Indium Corporation produces a diverse range of solders and solder paste products engineered to provide a solution to new and emerging challenges in the printed circuit board assembly and semiconductor manufacturing market space. The following products will be manufactured at the new facility:
The company serves a vast array of high-tech and critical application sectors including automotive, defence, mobile, medical, power module, and thermal management.
