Kelington Clinches RM170 Million Contract To Build Chip Facility In Sarawak

Kelington Group Berhad has clinched a contract worth approximately RM170 million from a global supplier of micro-electronic semiconductor solutions to undertake the construction work which includes architectural and structural works, civil works, mechanical and electrical works, and other process utilities work for integrated chips manufacturing facility at Sama Jaya Free Industrial Zone in Kuching, Sarawak.

The customer is a subsidiary of a Belgium-based global supplier of microelectronic semiconductor solutions company which mainly produces chips for use in wide-ranging applications, including the automotive industry.

Works will commence in January 2023 and are expected to be completed by March 2024.

Ir. Raymond Gan, Chief Executive Officer said, “We are delighted to kickstart the year with a major contract win from a global semiconductor company.  This is our second project in Sarawak whereby Kelington is involved in building a new semiconductor manufacturing facility. It reflects the growing trust and credibility in our capabilities to undertake general construction activities of new semiconductor plants.”

With engineering capabilities encompassing Ultra High Purity, Process Engineering and General Contracting, Kelington has successfully clinched new projects from reputable international corporations across the semiconductor and non-semiconductor industries.

Supported by the current outstanding orderbook of RM2.27 billion, the Group is confident of delivering a favourable financial performance in the coming years.

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