AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn. Bhd. has opened it new Integrated Circuit (IC) Substrates manufacturing facility in Kulim Hi-Technology Park, Kedah is the first production plant in Southeast Asia.
So far, the global technology leader invested just over EUR 1 billion in their AT&S Campus in the Kulim HighTech Park. MIDA said the substantial investment is poised to reshape the economic landscape of Malaysia, generating over 6,000 high-skilled job opportunities.
Mr. Andreas Gerstenmayer, CEO of AT&S, assured, “This step marks a true milestone for AT&S. With our new state-of-the-art factory for IC substrates, we are able to establish a completely new technology sector in Malaysia, one of the future global microelectronics hotspots. We will not only manufacture high-end IC substrates for high-performance processors at our new facility, but also conduct R&D activities at this location. This creates a win-win situation for both, AT&S as well as the Malaysian society as an investment in R&D is an investment in the future of a country.”
“With the AT&S investment in Malaysia, we are creating thousands of high-tech jobs in the region, till end of this year almost 2500. This will help to set-up the framework for future growth in Malaysia”, says AT&S Board Member and Executive Vice President for BU Microelectronics, Ingolf Schroeder. “We see it as our natural responsibility as an international company, to truly live our social commitment and our positioning as an inclusive, diverse and responsible employer at any new location.”
The Kulim operations, set to launch in Q42024, will specialise in integrated circuit substrates, facilitating connections between silicon dies and printed circuit boards. Characterised by multiple layers connected by dense conductor paths, IC substrates surpass the density of conventional PCBs. This advanced technology is increasingly favoured for high-end applications such as edge computing in cloud services, data centres, server farms, and various health and consumer devices, aligning with the trend of continuous miniaturisation in the industry.
