Siliconware Precision Industries Co., Ltd. (SPIL), a major global semiconductor packaging and testing company, broke ground of its Malaysia P1 plant at Bandar Cassia Technology Park, Pulau Pinang.
This state-of-the-art 8-hectare facility represents a substantial investment of RM6 billion. Over the next 15 years, the plant is projected to create nearly 3,000 skilled jobs, introduce advanced packaging and testing technologies such as wafer bumping, and offer comprehensive turnkey solution (including wafer bumping, wafer-level chip packaging, flip chip packaging and testing). This initiative is expected to significantly reduce production cycles, enhancing efficiency and competitiveness in the semiconductor industry.
Mr. Michael Chang, CEO of SPIL Malaysia, noted that SPIL’s expansion aligns with global trends, positioning Malaysia as an important hub for East Asia and the global industrial supply chain. This strategic move will strengthen the global packaging and testing market, driving innovation and development within the Group, and contributing to economic growth in the Oriental Silicon Valley.
