Intel Corporation is set to deepen its footprint in Malaysia’s semiconductor ecosystem, with its advanced packaging complex and assembly manufacturing operations expected to commence later this year.
Prime Minister Anwar Ibrahim said the development follows a recent briefing by Intel Chief Executive Officer Tan Lip-Bu and the company’s leadership team on the progress of its expansion plans in the country.
The investment centres on the establishment of an advanced packaging facility alongside assembly and test manufacturing capabilities, critical segments in the global semiconductor value chain that are increasingly becoming strategic amid supply chain realignments.
Naga Chandrasekaran, Executive Vice President of Intel Foundry, outlined plans to roll out the first phase of operations focusing on assembly and testing for advanced packaging.
“I welcome Intel’s decision to begin operations at the complex later this year,” Anwar said in a social media post, signalling confidence in Malaysia’s position as a key node in Intel’s global manufacturing network.
The expansion underscores Malaysia’s ongoing efforts to move up the semiconductor value chain, particularly in higher-value segments such as advanced packaging, which plays a crucial role in enabling next-generation chip performance.
Beyond infrastructure, the discussions also highlighted the importance of workforce readiness, with continued emphasis on training and upskilling local talent across the semiconductor ecosystem.
This aligns with the government’s broader push under the MADANI economic framework to create high-value jobs and strengthen domestic capabilities in strategic industries.
Bernama
