HeiTech Padu Settles RM7 Million Dispute With Perkeso

HeiTech Padu Berhad has reached an amicable settlement with Pertubuhan Keselamatan Sosial (PERKESO) over a long-running legal dispute at the Kuala Lumpur High Court.

The group said both parties agreed to resolve the case via a consent judgment without any admission of liability.

Under the settlement terms, HeiTech will pay RM7 million in 28 instalments, beginning 28 May 2026. The company noted that it has yet to be served with the sealed consent judgment.

Following the agreement, all remaining trial dates scheduled for May and June 2026 have been vacated.

HeiTech said the settlement is not expected to have any material adverse effect on its financial position or operations

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