SkyeChip Bhd is strengthening its position in the global semiconductor industry through its silicon intellectual property (IP) capabilities, strategic ecosystem partnerships and participation in international standards development, according to CIMB Securities.
In a report following a meeting with SkyeChip Finance Director Galvin Wong, the research house highlighted the company’s strong value proposition as a home-grown semiconductor design player benefiting from the rapid adoption of artificial intelligence (AI) and next-generation computing technologies.
SkyeChip specialises in silicon IP and custom application-specific integrated circuit (ASIC) design, generating revenue primarily through a licensing model for its IP portfolio while also earning engineering and design fees from customised ASIC projects.
Its technology portfolio includes advanced high-bandwidth memory (HBM) interfaces, Network-on-Chip (NoC) architectures, die-to-die (D2D) interface IP, new product introduction (NPI) engineering, and high-volume manufacturing enablement (HVME).
According to CIMB Securities, these capabilities position the company to benefit from increasing demand for high-performance semiconductor solutions, particularly those supporting AI applications and advanced computing.
The research house noted that SkyeChip is actively broadening its partnerships across the semiconductor ecosystem beyond traditional foundry relationships.
A key focus has been collaboration with outsourced semiconductor assembly and test (OSAT) providers, enabling the company to validate and optimise its IP for real-world advanced packaging environments while improving reliability testing and silicon validation.
Through these efforts, SkyeChip has secured access to ASE, Taiwan-based Advanced Semiconductor Engineering, the world’s largest OSAT provider.
CIMB Securities said the relationship is strategically significant as the semiconductor industry increasingly adopts chiplet architectures, which require more sophisticated packaging technologies to improve performance and efficiency.
The report also highlighted SkyeChip’s active participation in international semiconductor standards development.
The company is a member of the Joint Electron Device Engineering Council (JEDEC), the global standards body responsible for developing specifications for microelectronics technologies.
Through its involvement, SkyeChip contributes to the development of future standards covering memory interface technologies such as Low-Power Double Data Rate (LPDDR) memory and High-Bandwidth Memory (HBM).
CIMB Securities said this provides the company with early visibility into emerging technology trends, opportunities to influence future specifications and greater credibility when engaging global customers.
On valuation, CIMB Securities noted that SkyeChip is currently trading at approximately 65 times calendar year 2027 price-to-earnings (P/E), based on Bloomberg consensus estimates.
The valuation is supported by expectations of 32% earnings growth in CY2027, reflecting optimism over the company’s prospects as AI adoption, advanced memory technologies and semiconductor innovation continue to drive demand for specialised chip design solutions.
The research house views SkyeChip’s combination of proprietary silicon IP, expanding industry partnerships and participation in global technology standards as strengthening its long-term positioning within the semiconductor sector.
