Malaysian deep tech startup nanoSkunkWorkX (nSWX) has raised US$2 million in seed funding led by Singapore-based Tin Men Capital to advance its technology aimed at improving heat and current management in AI chip packaging.
The funding will support semiconductor partner qualification, scale its interface-engineering platform and advance its hydrogen and diagnostics programmes across Asia.
nSWX develops thin-film interfaces designed to improve how heat, energy and electronic signals move between materials. Its lead product, nSD-I, is designed to improve current carrying and heat management without replacing copper or existing manufacturing processes.
The company said peer-reviewed work found its graphene-copper films could move heat across their surface more than twice as effectively as a copper baseline, with follow-up testing showing the performance advantage remained after use in pre-qualification components.
“The cost of building and operating AI infrastructure can be dramatically reduced through small efficiency gains at the process step level, and for us, the opportunity lies in improving how the copper inside the packaging carries current, heat, and signals. This round will allow us to prove to industry partners just how transformative that small step can be,” said Iqbal Shamsul, Co-Founder and CEO of nanoSkunkWorkX.
The latest funding builds on earlier backing from Gobi Dana Impak and Kumpulan Modal Perdana. nSWX said it has developed its core platform, three product lines and generated its first revenue with less than US$1.5 million in external pre-seed capital.
The company was co-founded by former NASA principal investigator Dr Amani Salim and Iqbal Shamsul and was selected for the inaugural SemiconStart Malaysia cohort led by MTDC and Silicon Catalyst UK.
