Datasonic Receives LOA From Perkeso For A Sum Of RM9.6 Million

Datasonic Group Bhd received and accepted the Letter Of Award (LOA)  dated 10 June 2022 from Pertubuhan Keselamatan Sosial (PERKESO) to provide the services of developing the Data Analytics Hub for Employment Insurance System, for a period of five (5) years commencing from 1 July 2022 to 30 June 2027 for a contract sum of RM9,658,398.40.

The LOA was made to Datasonic Technologies Sdn Bhd, a wholly-owned subsidiary of Datasonic Group Bhd.

Under the terms of the LOA, DTSB is required to furnish a performance bond for the amount of RM96,590.00 to PERKESO, with a validity period commencing from 1 July 2022 to 30 June 2028.

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