Key ASIC has made the announcement that the company won contracts from an undisclosed customer (herein as “S Company”) total to over RM28M over three (3) year period.
According to Key ASIC’s official statement, “as the products are of leading edge in nature and have not officially launched to the market, more information of the chips maybe disclosed at the appropriate time.”
There are total of three (3) System on Chip (SoC) design wins and the chips will go into engineering production in the next 3 months and subsequently going into mass production.
Key ASIC will deliver wafers and chips in the next three (3) years under the contract. According to S Company, the chips are likely be in mass production for at least next 5 years though the current contracts are for three (3) years only. Mass production contracts for additional three (3) years are expected in due course since the chips consist of the IPs of Key ASIC.
Designed with Key ASIC’s IPs and Know-how, the cutting-edge chips are designed to be used in the transformation to industrial 4.0 that involve the Internet of Things (IOT), intelligent automation and wireless communication of the devices, robotic equipment, and process control.
“Our robust pool of IPs and engineering capabilities in Internet of Things and wireless communication enable us to provide the necessary expertise and ingredients to our customers in making these chips successful and competitive. We will continue to invest in the development of advance IPs in Artificial Intelligence, Internet of Things (IOT), communication, automotive, medical, and new energy applications to accelerate customer’s success,” said Eg Kah Yee, Chairman and CEO of Key ASIC.
“With the core technologies and competency, we expect to see more design wins in the near future as these markets
are growing rapidly and will contribute to the Company financially,” he added.
