JF Technology Berhad had a commendable achievement despite a challenging year in FY23, given the intensified market uncertainties stemming from a myriad of macroeconomic obstacles.
In a statement, its managing director Datuk Foong Wei Kuong said after its 17th Annual General Meeting (AGM) that the group is able to equal the best-ever top-line performance posted in the prior year.
“This is credited to our highly sustainable and resilient business model with recurring and compounding sales of test consumables combined with the maturation of our growth engines.
“Forging ahead, our excitement and focus remain on our 6 growth engines and JF 4.0 transformation,” he said today (Dec 5).
As part of this transformation, Foong said the group has recently set up a joint venture company in Malaysia with Shenzhen HFC Co, Ltd (Shenzhen HFC) to produce materials used in high-end semiconductor chips for artificial intelligence (AI) and electric vehicle (EV) applications.
Shenzhen HFC, he added, stands at the forefront of utilising graphene materials for heat dissipation in AI chips.
“Therefore, being the leader in the material science of graphene for this application may potentially lead to industry dominance.
“All in all, we continue to be positive on the group’s long-term prospects as we are ready to ride on the forthcoming wave of recovery of the semiconductor industry,” he concluded.
JF Technology Berhad, high-performance test contacting solutions for global integrated circuit (IC) makers, has paid a total dividend of one sen per share amounting to RM9.3 million in FY23. This translated to a payout of 76.2% based on net profit of RM12.2 million.
