JF Technology Berhad has entered into a Joint Venture Agreement with HFC Industry HK Limited, a subsidiary of Shenzhen HFC Co., Ltd. to incorporate HFC Tech Sdn. Bhd., a joint venture company in Malaysia for the purpose of design and manufacture of electromagnetic interference shielding materials, thermal interface materials, absorbing materials, etc.
Shenzhen HFC specialises in integrated research and development manufacturing and sale of EMI shielding materials, thermal interface materials, wave-absorbing materials, and ferrite. It presently serves a diverse range of industries and applications, including artificial intelligence, semiconductors, smartphones, electric vehicles, telecommunications as well and electronics manufacturing services.
Headquartered in Shenzhen, China, Shenzhen HFC currently has over 400 employees, backed by 20 years of operating track record since its establishment in 2003. In addition to its manufacturing base in Shenzhen, it also has production facilities in Chongqing and Zhejiang. Shenzhen HFC places strong emphasis on R&D and owns more than 140 patents. It has 4 R&D
centres in Chongqing, Wuhan, Zhejiang and Shenzhen supported by a highly qualified R&D team of 60 professionals.
Both parties are looking at producing various cutting-edge products such as EMI shielding materials and thermal interface materials, which are currently used in various applications, including semiconductor chips for AI and EV. Shenzhen HFC is a pioneer in the use of graphene materials for heat dissipation in Al chips.
Under the JVA, HFCI will be investing RM3.2 million in HFC Tech for a 80%- ownership while JFI shall contribute RM0.8 million for the balance 20% stake. Therefore, the registered capital of HFC Tech will be RM4.0 million, which will be utilised for operational needs
