Unisem Bhd plans to invest an estimated RM396 million in the second phase expansion of its semiconductor manufacturing plant in Gopeng, Perak, as it seeks to meet rising demand for advanced packaging linked to artificial intelligence, data centres and high-performance computing.
The group said the proposed expansion will involve the construction of a new production facility with infrastructure and utilities at an estimated cost of RM196 million.
The facility is expected to have a total built-up area of about 40,000 sq m.
Half of the new production facility will be leased to Unisem Advanced Technologies Sdn Bhd (UAT), a wholly-owned subsidiary of Unisem, to expand its wafer bumping operations.
The associated facilitisation for UAT is estimated to cost another RM200 million, bringing the total estimated investment for the Phase 2 expansion to RM396 million.
Unisem said the expansion is intended to increase the group’s manufacturing capacity for wafer bumping and post-bump services to meet growing customer demand.
The company said the project forms part of its broader strategy to capture stronger demand for advanced semiconductor packaging, particularly from applications in AI, data centres and high-performance computing.
The latest expansion follows the company’s earlier announcement in March 2022 on the construction of its new semiconductor production facility in Gopeng.
Unisem said the additional capacity is expected to strengthen its positioning for long-term growth as demand for more advanced semiconductor packaging solutions continues to increase.
