Kelington Group Berhad through its wholly-owned subsidiary in Singapore announced that it has accepted a Letter of Award with a provisional contract price of USD 452 million (approximately RM1.83 billion) for the turn-key total facility tool hookup services for a semiconductor wafer fabrication facility in Gujarat, India.
Under the LOA, Kelington will act as the main contractor and undertake the overall design, installation, connection, testing and handover of manufacturing, laboratory and support tools, together with related tool-specific support systems for Module 1 and Module 2 of the facility. The works are expected to be completed over a period of 30 months, with completion targeted by Feb 2029.
The provisional contract price comprises USD249.9 million (approximately RM1.01 billion) for Module 1 and USD 202.0 million (approximately RM817.2 million) for Module 2, covering up to 886 tools across both modules. The final contract value will be determined based on the actual quantities of tools and services executed.
